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1

Performance Study of a 980 nm GaAs Based Laser Diode Chip in a Moisture Condensing Environment

Madduri, Sushma, Sammakia, Bahgat G., Infantolino, William, Chaparala, Satish C., Hughes, Lawrence C., Harris, J. Micheal

Journal:

Journal of Electronic Packaging

Year:

2012

Language:

english

File:

PDF, 1.30 MB

english, 2012

2

The Evolution of Capacitors [History]

Brusso, Barry, Chaparala, Satish

Journal:

IEEE Industry Applications Magazine

Year:

2014

Language:

english

File:

PDF, 2.57 MB

english, 2014

3

[IEEE 2014 International Semiconductor Laser Conference (ISLC) - Palma de Mallorca, Spain (2014.9.7-2014.9.10)] 2014 International Semiconductor Laser Conference - Tuning Efficiency and Modulation Speed of Epi-Up and Epidown Mounted Distributed Feedback Quantum Cascade Laser

Xie, Feng, Caneau, Catherine, Chaparala, Satish, Leblanc, Herve P., Ho, Ming-Tsung, Coleman, Sean, Hughes, Lawrence C., Zah, Chung-En

Year:

2014

Language:

english

File:

PDF, 356 KB

english, 2014

4

Special Section on InterPACK 2013

Chaparala, Satish, Gupta, Ashish, Hoivik, Nils, Lee, Y. C.

Journal:

Journal of Electronic Packaging

Year:

2014

Language:

english

File:

PDF, 75 KB

english, 2014

5

Special Section on InterPACK 2015

Chaparala, Satish, Gupta, Ashish, Asheghi, Mehdi, Suhling, Jeffrey, Ikeda, Toru, Luo, Xiaobing

Journal:

Journal of Electronic Packaging

Year:

2016

Language:

english

File:

PDF, 79 KB

english, 2016

6

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD Assembly With Sn3.9Ag0.6Cu SAC Alloy

Xiao, Qiang, Armstrong, William D., Pitarresi, James M., Chaparala, Satish C., Rogeman, Brian D., Sammakia, Bahgat G., Nguyen, Luu

Year:

2005

Language:

english

File:

PDF, 1.53 MB

english, 2005

7

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Die Stress Analysis in Stacked Die Chip Scale Packages (SCSP)

Chaparala, Satish C., Andros, Frank E., Infantolino, Bill, Sammakia, Bahgat G., Guttikonda, Satish C., Zhao, Julia, Sengupta, Dipak

Year:

2005

Language:

english

File:

PDF, 369 KB

english, 2005

8

Nanolubrication of sliding components in adaptive optics used in microprojectors

Bharat Bhushan, Hyungoo Lee, Satish C. Chaparala, Vikram Bhatia

Journal:

Applied Surface Science

Year:

2010

Language:

english

File:

PDF, 1.60 MB

english, 2010

9

Chemical bonding and degradation of ultrathin liquid films for nanolubrication of sliding components in adaptive optics

Bharat Bhushan, Hyungoo Lee, Satish C. Chaparala, Vikram Bhatia

Journal:

Colloids and Surfaces A: Physicochemical and Engineering Aspects

Year:

2010

Language:

english

File:

PDF, 3.94 MB

english, 2010

10

Efficient and compact green laser for micro-projector applications

Vikram Bhatia, Steven J. Gregorski, Dragan Pikula, Satish C. Chaparala, David A. S. Loeber, Jacques Gollier, Joan D. Gregorski, Martin Hempstead, Yukihiro Ozeki, Yoshiaki Hata, Kazuhiro Shibatani, Fum

Journal:

Journal of the Society for Information Display

Year:

2009

Language:

english

File:

PDF, 958 KB

english, 2009

11

[IEEE 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM) - Orlando, FL, USA (2008.05.28-2008.05.31)] 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - A review of non-hermetic optoelectronic packaging

Madduri, Sushma, Sammakia, Bahgat G., Infantolino, Bill, Chaparala, Satish

Year:

2008

Language:

english

File:

PDF, 586 KB

english, 2008

12

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Thermal management of mid-infrared (IR) quantum cascade lasers

Chaparala, Satish C., Xie, Feng, Caneau, Catherine, Hughes, Lawrence C., Zah, Chung-en

Year:

2010

Language:

english

File:

PDF, 673 KB

english, 2010

13

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Glass interposer substrates: Fabrication, characterization and modeling

Keech, John, Piech, Garrett, Pollard, Scott, Chaparala, Satish, Shorey, Aric, Wang, Bor Kai

Year:

2013

Language:

english

File:

PDF, 663 KB

english, 2013

14

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Fabrication of 3D-IC interposers

Keech, John, Chaparala, Satish, Shorey, Aric, Piech, Garrett, Pollard, Scott

Year:

2013

Language:

english

File:

PDF, 1.06 MB

english, 2013

15

High power and high temperature continuous-wave operation of distributed Bragg reflector quantum cascade lasers

Xie, Feng, Caneau, Catherine G., LeBlanc, Herve P., Ho, Ming-tsung, Wang, Jie, Chaparala, Satish, Hughes, Lawrence C., Zah, Chung-en

Journal:

Applied Physics Letters

Year:

2014

Language:

english

File:

PDF, 1.35 MB

english, 2014

16

[ASME ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability - San Francisco, California, USA (July 19–23, 2009)] ASME 2009 InterPACK Conference, Volume 1 - Thermo-Mechanical Analysis of a Laser Diode Chip in an Opto-Electronic Package

Chaparala, Satish C., Hughes, Lawrence C., Kwak, Jae, Park, Seungbae

Year:

2009

Language:

english

File:

PDF, 415 KB

english, 2009

17

[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes - Dynamic Analysis of Thin Glass Under Ball Drop Impact With New Metrics

Xue, Liang, Coble, Claire R., Lee, Hohyung, Yu, Da, Chaparala, Satish, Park, Seungbae

Year:

2013

Language:

english

File:

PDF, 1.56 MB

english, 2013

18

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - A fracture mechanics based parametric study with dimensional variables of the Cu-Cu direct thermo-Compression bonded interface using FEA

Park, Ah-Young, Chaparala, Satish C., Park, Seung Bae

Year:

2015

Language:

english

File:

PDF, 1.02 MB

english, 2015

19

Advancing Industry Practices and Improving Electrical Safety [Conference News]

Chaparala, Satish

Journal:

IEEE Industry Applications Magazine

Year:

2013

Language:

english

File:

PDF, 1.37 MB

english, 2013

20

Dynamics behavior of flat glass panels under impact conditions: Experiments and numerical modeling

Chaparala, Satish, Xue, Liang, Yu, Da, Park, Seungbae

Journal:

Journal of the Society for Information Display

Year:

2015

Language:

english

File:

PDF, 1.66 MB

english, 2015

21

Risk assessment of the crack propagation and delamination of the Cu-to-Cu direct bonded (CuDB) interface

Park, Ah-Young, Chaparala, Satish C., Park, SeungBae

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 2.87 MB

english, 2016

22

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Deformation of Display for Handheld Devices During Drop Impact

Singh, Charandeep, Chaparala, Satish, Zhou, Chunfeng, Zhang, Bin, Park, S. B.

Year:

2016

Language:

english

File:

PDF, 447 KB

english, 2016

23

[IEEE 2015 IEEE IAS Joint Industrial and Commercial Power Systems / Petroleum and Chemical Industry Conference (ICPSPCIC) - Hyderabad, India (2015.11.19-2015.11.21)] 2015 IEEE IAS Joint Industrial and Commercial Power Systems / Petroleum and Chemical Industry Conference (ICPSPCIC) - Towards a globalization of safety standards for electrical work

Parise, Giuseppe, Satish, Chaparala, Parise, Luigi

Year:

2015

File:

PDF, 263 KB

2015

24

[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes - An Experimental and Numerical Study of the Dynamic Fracture of Glass

Xue, Liang, Niu, Yuling, Lee, Hohyung, Yu, Da, Chaparala, Satish, Park, Seungbae

Year:

2013

Language:

english

File:

PDF, 1.69 MB

english, 2013

25

[ASME ASME 2012 International Mechanical Engineering Congress and Exposition - Houston, Texas, USA (Friday 9 November 2012)] Volume 4: Dynamics, Control and Uncertainty, Parts A and B - Dynamic Analysis of Large Specialty Glass Panels Under Ball Drop Impact — Numerical Modeling and Measurements

Chaparala, Satish C., Samala, Praveen R., Jacobs, Joshua M., Pesansky, Jonathan D.

Year:

2012

Language:

english

File:

PDF, 750 KB

english, 2012

26

[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes - A Fracture Mechanics Based Parametric Study of the Copper-to-Copper Direct Thermo-Compression Bonded Interface Using Finite Element Method

Park, Ah-Young, Chaparala, Satish, Park, Seungbae

Year:

2013

Language:

english

File:

PDF, 2.13 MB

english, 2013